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PackExpo 2010 Packaging & Packaging Machinery Conference

Chicago, IL, October 31 - November 3, 2010 - PACK EXPO International 2010 is the premier trade show for packaging technology, machinery, materials, packages and containers. A powerful lineup of presentations on a wide range of topical subjects is planned, including packaging innovation, brand distinction, digital package printing, financing strategies and more. Participate in these targeted and timely sessions to learn what’s happening in the industry and what’s developing in the global marketplace. Visit www.packexpo.com more program information.